Amazon.com Inc says that when it comes to another new
customer in the foundry chip business, Intel has been in control for decades
with technology to make the smallest and fastest computing chips. increase.
But Intel lost it and led to TSMC and Samsung. These manufacturing services help Intel rivals Advanced Micro Devices Inc and Nvidia Corp make better chips than Intel. AMD and Nvidia are designing chips manufactured by a rival chip maker called the foundry.
Intel said on Monday that it hopes to regain its lead by
2025, explaining the five sets of chip manufacturing technology it will roll
out over the next four years.
It uses the most advanced small switch that converts digital
1s and 0s, the new design of the transistor for the first time in 10 years. As
early as 2025, ASML in the Netherlands will use a new generation of machines
that use so-called extreme UV lithography to project chip designs onto silicon
as if printing old-fashioned photographs.
“We’re giving a lot of details to the streets to be accountable,”
Intel CEO Pat Gelsinger said in an interview with Reuters, referring to
investors. Told.
Intel also said it would change the naming scheme for chip
manufacturing technology, using names like “Intel 7”, to match the way TSMC and
Samsung bring competing technologies to market.
In the world of chips where smaller is better, Intel used to
use names that imply the size of “nanometer” features. However, over time, the
names used by chip makers have become arbitrary marking terms, said Dan
Hutcheson, CEO of VLSI research, an independent semiconductor forecasting
company. This gave the false impression that Intel was uncompetitive, he said.
Intel’s first major customers are Qualcomm and Amazon.
Qualcomm, which dominates chips for mobile phones, uses what Intel calls the
20A chip manufacturing process. It uses new transistor technology to reduce the
amount of power consumed by the chip.
Increasingly manufacturing its own data center chips for
Amazon Web Services, Amazon has not yet used Intel’s chip manufacturing
technology, but Intel is the process of assembling chips and “chiplets” or
“tiles.” Uses packaging technology from. So-called 3D formation. According to
analysts, Intel excels at this packaging technology.
“We had deep technical involvement over the hours with these
first two customers, and many others,” Gelsinger said.
At the event, Gelsinger announced the news that Qualcomm’s
deal includes a “major mobile platform” and is working “strategicly”, Intel
will generate revenue and production from customer acquisition Did not reveal
details. Qualcomm has a long track record of using multiple foundry partners
for the same chip.
The biggest question Intel is facing is whether it can
fulfill its technology promise after years of delay under former CEO Brian
Krzanich. In recent weeks, Intel has announced delays in a new data center chip
called Sapphire Rapids.
But Real World Technologies analyst David Kanter said Intel
is more cautious than ever. Years of delay were partly due to the “arrogance”
of tackling multiple technical issues with a single generation of technology.
This time, Intel is rolling out five generations of
technology in four years to tackle smaller issues. He also states that if not
ready, the next “Intel 18A” process may not introduce new EUV technology.
“Intel will catch up with TSMC in the next few years and
stay ahead in several ways,” said analyst Canter. “There are people at Intel
who are constantly looking at ways to introduce new materials and technologies
to improve performance.” -Reuters
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