MediaTek, the popular Taiwanese chipset maker, on Wednesday launched two new chipsets as part of its Dimensity lineup of SoCs, namely the Dimensity 920 and Dimensity 810.
For those of you unaware, the MediaTek Dimensity SoCs are
known for offering chipsets designed for mobile devices, with the standout
feature being integrated 5G modems. The latest additions to the family are
quite the same and will allow budget devices or mid-range handsets to ship with
5G.
This is a better deal in comparison to the MediaTek 900,
which came with 2 ARM Cortex-A78 cores at up to 2.4GHz coupled with 6 ARM
Cortex-A55 cores. The GPU in use was the Mali-G68.
Connectivity-wise, the Dimensity 920 uses an integrated 5G
modem that supports dual VoNR or Voice over New Radio, dual SIM 5G, up to 2CC
carrier aggregation and SA, NSA networking. Wi-Fi 6, Bluetooth 5.2 and
multi-GNSS is also supported.
The press release from MediaTek reveals that the chip also
supports multiple proprietary tech features, which include the likes of
MediaTek’s Smart Adaptive Displays tech that allows for adjustment of refresh
rate based on the content being consumed, 5G UltraSave for better efficiency
during 5G networking and HyperEngine 3.0 which can provide better gaming
performance, in conjunction with Super Hotspot technology.
The chipset has been designed keeping cheaper 5G handsets in
mind; hence the CPU config makes a lot of sense. LPDDR4X RAM and UFS storage
are also supported, alongside 120Hz FHD display support.
Much like the bigger brother Dimensity 920, the 810 is a 6nm
module with the ISP featuring MFNR and MCTF, up to 64MP main cameras, AI
features, MediaTek’s HyperEngine 2.0 and dual camera concurrency. The
integrated 5G modem supports up to 2CC CA, mixed duplex FDD+ TDD CA, VoNR and
dual SIM 5G. Both chips will ship in smartphones starting Q3 2021, as per
MediaTek.
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