The tool called "high-NA EUV" produces beams of
focused light that create the microscopic circuitry on computer chips used in
phones, laptops, cars and artificial intelligence devices such as smart
speakers. EUV stands for extreme ultraviolet, the wavelength of light used by
ASML's most advanced machines.
"TSMC will bring in high-NA EUV scanners in 2024 to
develop the associated infrastructure and patterning solution needed for
customers to fuel innovation," said Y.J. Mii, senior vice president of
research & development, during TSMC's technology symposium in Silicon
Valley.
Mii did not say when the device, the second generation of
extreme ultraviolet lithography tools for making smaller and faster chips,
would be used for mass production. TSMC rival Intel has said it will use the
machines in production by 2025 and that it would be the first to receive the
machine.
As Intel enters the business of making chips that other
companies design, it will be competing with TSMC for those customers.
Kevin Zhang, TSMC senior vice president of business
development, clarified that TSMC would not be ready for production with the new
high-NA EUV tool in 2024 but that it would be used mostly for research with
partners.
"The importance of TSMC having it in 2024 means they
get to the most advanced technology faster," said TechInsights' chip
economist Dan Hutcheson, who was at the symposium.
"High-NA EUV is the next major innovation in the
technology that will put the chip technology at the lead," Hutcheson said.
On Thursday, TSMC also gave more details on the technology for its 2nm chips, which it said are on track for volume production in 2025. TSMC said it has spent 15 years developing so-called "nanosheet" transistor technology to improve speed and power efficiency and will use it for the first time in its 2nm chips. © Reuters