India is planning an investment worth up to $15.2 billion (1.26 trillion Indian rupees) to build three new semiconductor plants, including its first semiconductor fab facility – part of the country’s big bid to take on China, Taiwan and other countries in the chip race.
The South Asia country gave the go-ahead on Thursday to firms
including Tata Group and CG Power, as the country pursues its goal of becoming
an electronics powerhouse.
India, which is seeking to rival countries such as Taiwan in
chipmaking, expects its semiconductor market to be worth $63 billion by 2026,
but does not yet have a chipmaking facility.
Prime Minister Narendra Modi wants to make India a chipmaker
for the world as his government tries to overcome setbacks faced in its bid to
offer $10 billion in incentives to the industry.
Indian Electronics Minister Ashwini Vaishnaw said
construction will begin on the plants within the next 100 days, adding that
they will manufacture and package chips for sectors including defence,
automobiles and telecommunication.
"This is a big decision for the country and a key
accomplishment towards making India a self-dependent country," Vaishnaw
told reporters.
He did not give updates on other key chipmaking applicants,
including Indian conglomerate Vedanta, Taiwan's Foxconn and Israel's Tower
Semiconductor.
Tata will partner with Taiwan's Powerchip to set up India's
first chipmaking plant worth 910 billion rupees in Gujarat state's Dholera, he
said, while CG Power will partner with Japan's Renesas Electronics Corp and
Thailand's Stars Microelectronics for a 76 billion rupees chip packaging plant,
also in Gujarat.
A third chip packaging plant worth 270 billion rupees will
be set up in the eastern state of Assam by Tata unit Tata Semiconductor
Assembly and Test Pvt Ltd, Vaishnaw added.