According to Ram Velaga, a senior vice president at Broadcom, who spoke with Reuters in a recent interview, the substantial speed boost offered by the Tomahawk 6 translates directly into tangible benefits for infrastructure builders. Fewer networking switches will be required to achieve the same task, potentially leading to more streamlined and cost-effective AI deployments.
The increasing importance of Broadcom's networking chips is inextricably linked to the rapid expansion of AI. The construction of AI data centers necessitates connecting hundreds, if not thousands, of chips to work in concert. This intricate web of interconnected processors demands specialized networking gear and chips, with the Tomahawk series standing as a cornerstone component in this infrastructure.
With the Tomahawk 6, Broadcom's engineers have pushed the boundaries of speed and capability, enabling its use in the construction of the truly massive data centers that are becoming essential for advanced AI applications. These next-generation facilities can link together over 100,000 graphics processors (GPUs), and Velaga even envisions a future where "a couple of years from now, you will start to see a million GPUs housed inside a physical building."
Notably, Broadcom's networking chips leverage the well-established Ethernet networking protocol, a standard that has underpinned global networks for decades. This stands in contrast to some rival technologies, such as Nvidia's InfiniBand, though Nvidia also offers several Ethernet-based products. Velaga emphasized the versatility of Ethernet, stating that "all of these networks can be very simply done on Ethernet, you don’t need esoteric technologies." This highlights Broadcom's commitment to delivering high-performance solutions within a widely adopted and understood framework.
The Tomahawk 6 also marks a significant technological advancement for the product line, being the first to integrate chiplets – a design approach where multiple smaller chips are combined into a single package. This technology, already widely adopted by other leading chip designers like Advanced Micro Devices, roughly doubled the amount of silicon area used in the Tomahawk 6's design, according to Velaga. This modular approach allows for greater flexibility, scalability, and potentially improved yields in chip manufacturing.
Broadcom is manufacturing the Tomahawk 6 switch using Taiwan Semiconductor Manufacturing Co's (TSMC) advanced three-nanometer process, signifying the cutting-edge nature of the silicon technology employed in its production. This collaboration with a leading foundry underscores Broadcom's dedication to leveraging the most advanced manufacturing capabilities to deliver top-tier performance for the burgeoning AI market.