Speaking at a conference hosted by research organization in Antwerp, Fouquet said progress is already underway across both logic and memory applications.
“In the next few months, we will be looking at the first few products, in memory, in logic, being exposed on the High-NA system”
The High-NA EUV machines represent the most advanced form of extreme ultraviolet lithography currently being developed. They are designed to etch circuit patterns with far greater precision than today’s systems, enabling features up to roughly 66% smaller—comparable to improving a camera lens to achieve sharper focus and finer detail in every shot.
Expensive tools, long payoff: the industry’s balancing act
Despite their technical promise, High-NA systems remain controversial due to cost. Each machine can reach up to $400 million, a figure that has prompted caution among major chipmakers.
, the world’s largest contract chip producer, has already indicated that it does not see immediate justification for adoption. Instead, it plans to extend the life of current EUV tools while relying on architectural innovations to continue performance gains.
Fouquet acknowledged the financial and technical barriers, but framed them as part of a predictable evolution rather than a setback.
“Those technologies are expensive. They are requiring qualification. But they are always designed with the idea that over time they will lower the cost of patterning,” Fouquet said.
The underlying argument from is that while upfront costs are high, the long-term payoff comes through improved efficiency in chip manufacturing, where even microscopic gains translate into massive scale advantages.
Intel leads early adoption push as memory makers follow
Among chipmakers, has taken the most aggressive stance in preparing to integrate High-NA EUV into its roadmap, viewing it as a potential leapfrog technology that could help close the gap with rivals such as and .
Memory producers are also moving in the same direction. has signaled interest in adopting the next-generation lithography tools as part of its long-term production strategy.
Still, the broader industry remains divided. While some firms see High-NA EUV as an inevitable step forward, others are opting to maximize existing platforms before committing to the new generation.
AI boom fuels long-term optimism for chip demand
Fouquet also pointed to the rapid expansion of artificial intelligence as a key driver sustaining semiconductor demand. He projected continued growth in chip sales at around 20% annually in the coming years, powered largely by AI workloads and data infrastructure expansion.
At the same time, he addressed concerns that ASML itself could become a production bottleneck if demand outpaces manufacturing capacity—a situation reminiscent of supply chain constraints seen during the COVID-19 period.
However, Fouquet added a lighter note when discussing industry pressures, suggesting that chipmakers themselves play a central role in determining how quickly the ecosystem expands.
In a subtle nod to executives from and , he remarked that they remain central to the pace of progress, saying they must scale production and continue investing in equipment to keep up with demand for advanced chips.
A technology in transition
As High-NA EUV moves closer to real-world deployment, the semiconductor industry finds itself balancing ambition with caution. The technology promises a major leap in chip precision and performance, but its high cost and complex qualification process mean adoption will likely be gradual rather than immediate.
For now, the first wave of chips emerging from these systems will serve as a critical test—both of the technology’s readiness and of the industry’s willingness to invest in its next frontier.