Huawei Technologies’ latest flagship Mate 80 series smartphone is powered by the new Kirin 9030 chip, which has been manufactured by China’s top semiconductor foundry, SMIC, using an enhanced 7-nanometre process. While this represents a technical advancement for China’s chipmaking industry, it remains behind the cutting-edge processes of global competitors TSMC and Samsung, according to a report by Canadian research firm TechInsights.

The Kirin 9030 utilizes SMIC’s N+3 process, described by TechInsights as a “scaled extension” of its previous N+2 7-nanometre node. Despite these improvements, the report notes that in absolute terms, the N+3 process is still significantly less advanced than the 5-nanometre technology currently employed by TSMC and Samsung.

“While SMIC continues to make progress, it is still behind the most advanced industry standards set by global competitors,” the report stated.

Huawei and SMIC did not respond immediately to requests for comment outside regular business hours.

This development comes amid growing scrutiny of China’s semiconductor industry. In October, the Chinese authorities added TechInsights, which frequently publishes analyses on Huawei and SMIC’s chip developments, to a list of “unreliable entities,” highlighting the sensitive geopolitical context surrounding advanced chip technology in the country.

The Kirin 9030 represents a notable milestone for Huawei, showcasing domestic chip manufacturing progress even as China continues to face technological gaps with global leaders. Analysts suggest that while the N+3 process is a step forward, the race to match the sophistication of TSMC and Samsung remains ongoing.