Huawei confirmed in a post on its website reports of its breakthrough in manufacturing a light source component used in EUV lithography systems that are needed to manufacture high-end processors at sub-10nm nodes.
The Chinese tech giant posted a video on its website to back
up claims about its breakthrough in EUV lithography. He also claimed to have
“entered the game” on his official website.
Chinese tech outlet MyDrivers cited information on China’s
National Intellectual Property Administration website that Huawei Technology
filed a patent application covering an EUV lithography process and its key
components in mid-November. The patent application number is 202110524685X.
Huawei’s request has not yet been approved. It is difficult
to judge whether Huawei already has the capacity to produce the whole set of
EUV equipment.
Huawei said on its website that the latest patent
application shows the use of EUV lithography technology to improve the
manufacture of integrated circuits and chipsets.
“Together, this process will form an interference pattern
that will continue to change with new light rays. Therefore, this will even out
the light exposure and solve the non-uniform light issues that often occur in
chip development” , according to the description on Huawei’s website. .
In addition to uniform light rays, this mechanism will
facilitate the creation and formation of nanoparticles that assemble into
integrated circuits or micro-chipsets.
“Furthermore, lithography mainly performs the transfer,
processing and creation of micro-nano graphics. It also checks all the elements
equipped in a chipset and verifies the appropriate size and other details in
the circuits,” according to Huawei.
A UDN report indicates that in addition to Huawei, local
research institutes in China, such as Tsinghua, have also come up with
technologies related to EUV lithography to overcome light source technology
barriers, mastering new light sources. that can be used for EUV lithography.
The Chinese Academy of Sciences has also mastered the mirror system technology.
Despite the breakthrough of EUV light source technology, the
EUV machine is not easy to manufacture, because there are more than 100,000
components in an EUV machine, requiring the collaboration of a huge supply
chain, which is a major hurdle for any country trying to build the equipment
from scratch without getting help from other component sources.
Huawei has been quietly building a domestic semiconductor
ecosystem over the past few years as it tries to stave off U.S. tech export
sanctions that have barred it from accessing advanced chips. It has invested in
a wide range of companies across the semiconductor supply chain, from EDA,
equipment and materials to foundry, testing and packaging.
The technology for which Huawei is applying for a patent
tries to solve the problem of uneven light intensity from the light source used
in the EUV lithography machine. According to the disclosed information, the
patent application proposes a reflector, a lithography device and a control
method thereof, which relates to the field of optics and can solve the problem
that coherent light cannot be homogenized. due to the formation of a fixed
interference pattern. and is optimized based on the lithography device for
extreme ultraviolet light, thus achieving the goal of homogenization.
The UDN report says that while Huawei is developing EUV
lithography, it is also developing technologies that “bypass” lithography. For
example, it bypasses monopoly American silicon wafer technology in favor of
optoelectronic wafers and other practices.
Interestingly, ASML, the company that is the world’s only
EUV equipment supplier, filed a similar patent application (US2016007434A1) in
2016, but has a different scope of patent rights.
The difference between the two patents is that Huawei uses a
rotating lighting device to reduce the number of bright or dark patterns in the
same area, while ASML’s patent allows the same beam of light to be split and
incident at different points to produce a uniform light. on the relative
movable and fixed flat panels and sets of reflectors.
ASML’s EUV machine uses Cymer’s light source device. Cymer
is headquartered in San Diego, California, and was acquired by ASML in 2013.
It took ASML 17 years to develop the first generation
multi-pattern EUV equipment, which so far has only been used by TSMC, Samsung,
Micron, Intel and SK Hynix. Currently, China does not have the right to access
EUVs, but can import DUVs which are used to produce mature node chips of 28nm
and above.
According to ASML’s website, its EUV technology uses light
with a wavelength of 13.5 nm, which is more than 14 times shorter than DUV
light.
The Laser Produced Plasma (LPP) source, droplets of molten
tin approximately 25 microns in diameter are ejected from a generator at 70
meters per second. As they fall, the droplets are first hit by a low intensity
laser pulse which flattens them into a pancake shape. Then, a more powerful
laser pulse vaporizes the flattened droplet to create a plasma that emits EUV light.
To produce enough light to make microchips, this process is repeated 50,000
times per second.
ASML announced on its third quarter 2022 earnings conference
call that it will continue to ship DUV lithography equipment to China and
increase its production capacity to 90 EUV and 600 DUV systems (2025-2026) and
would increase its High-NA EUV capacity to 20 systems (2027-2028).
0 comments:
Post a Comment